Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

We are seeking a highly experienced PCB Engineer to drive next-generation Datacenter and High-performance computing (HPC) platforms.
This role will focus on advanced PCB technologies, manufacturability optimization, and supplier engagement, supporting both NPI and volume production while shaping Qualcomm’s future hardware roadmap.

Key Responsibilities

1. PCB Design & Manufacturing Readiness

• Hands on experience with PCB process including defining and drive PCB design guidelines / stack-up / routing strategy for high-speed, high-layer count datacenter PCB boards 

• Develop and maintain DFM (Design for Manufacturability) libraries to ensure design compliance with supplier capability 

• Collaborate with cross-functional teams (SI/PI, mechanical, thermal, system architecture) to optimize board performance and manufacturability 

2. Supplier Engagement & Capability Validation

• Engage with PCB manufacturers (fabricators & assemblers) to:  

• Understand design rule capability (trace/space, via structures, stack-up complexity, materials) 

• Evaluate BOM capability including advanced laminates, low-loss materials, and new technologies 

• Collect and analyze supplier data to validate manufacturing capability vs design requirements 

• Drive multi-source strategy and supplier qualification for high-volume production 

3. NPI & Manufacturing Support

• Support critical NPI builds for datacenter platforms (AI/Compute PCB boards, high-power systems) 

• Troubleshoot PCB fabrication / assembly issues:  

• Yield excursions 

• Reliability failures 

• Process limitations 

• Lead root cause analysis and implement corrective & preventive actions (CAPA) 

4. Technology Roadmap Development

• Drive PCB technology roadmap in collaboration with suppliers:  

• Advanced via structures (HDI, mSAP, via-in-pad, stacked vias, etc.) 

• New materials (low-loss, high-Tg, ultra-thin core, glass core evolution) 

• High layer count / ultra-high density interconnect solutions 

• Pioneer and implement new structures, technologies, and BOM solutions to advance Qualcomm’s platform capability 

5. Industry & Competitive Intelligence

• Monitor industry trends (Datacenter, AI infrastructure, high-speed PCB technology) 

• Perform competitive benchmarking (Hyperscalers, ODM ecosystem, etc.) 

• Identify emerging strategies to ensure Qualcomm remains aligned with leading-edge technology directions 

Minimum Qualifications:

•    Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.

Preferred Qualifications:

• BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field  
• 15+ years of PCB / substrate engineering experience (Datacenter / server / high-speed system preferred)  

​​Strong understanding of:

• High-speed design fundamentals (SI/PI, loss, impedance control)
• Advanced PCB fabrication processes (MLB, HDI, mSAP, build-up, lamination cycles) 

• PCB materials (low-loss laminates/Core & PPG, Cu foil, Plating chemistry, SR, Surface Finish, etc.) 
• Experience working directly with PCB suppliers (fab + assembly/CM) 

• Proven track record in NPI builds and manufacturing issue resolution 

• Experience with AI accelerators / server motherboards / high-power boards (100kW+ rack architecture familiarity preferred) 

• Familiarity with advanced packaging interaction (SiP, substrate, bridge-based systems) 

• Experience driving technology co-development with suppliers 

• Ability to influence cross-functional and executive stakeholders 

Key Competencies

• Strong analytical and problem-solving skills 

• Data-driven decision making 

• Ability to communicate clearly with suppliers, internal teams, and executive leadership 

• Experience managing ambiguity in fast-paced NPI environments 

Impact

In this role, you will directly influence:

• Qualcomm’s datacenter and AI hardware competitiveness 

• Supplier ecosystem maturity and scalability 

• Adoption of next-generation PCB technologies and materials 

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

To all Staffing and Recruiting Agencies

: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range

and Other Compensation & Benefits:

$201,600.00 - $302,400.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm.  We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus).  In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.