Staff Process Engineer - Die Attach / Clip Attach
Job description
The Die Attach /Clip Attach (Solder) Engineer own, develop, and sustain the solder die attach & clip attach process to achieve stable yields, high equipment uptime, and full compliance to reliability and customer requirements. The role demands wide semiconductor manufacturing experience across high‑mix assembly, rigorous process controls, and data‑driven problem solving to support both NPI ramp and high‑volume manufacturing.
Responsibilities
ØProcess Ownership & Control •Define, sustain and optimize key die attach parameters and tooling effectiveness. •Establish and maintain the recipe management system, process/set-up controls, process capability, process performance (Ppk). •Generates and maintain PFMEA, Control Plan, Work Instruction (WI), One Point Lesson (OPL), reaction plans (OCAP) ØYield & Quality Improvement •Lead problem solving using 8 Discipline for internal and external issues such as customer complaints (EFAR). •Knowledgeable in DMAIC approach for continuous improvement projects. •Well verse in using the root cause analysis tools such as 5‑Whys/Ishikawa for issues induced by the die attach process especially for GMRB documentation •Reduce ppm loss and scrap disposition through targeted DOEs, parameter windows process validation, and direct material/tooling improvements. ØEquipment & Materials Engineering •Own the effectiveness of the recipe management system, drives tooling design and qualification. •Qualify materials (solder paste/DAF, flux, substrates/leadframes, plating finishes) and define incoming/line qualification criteria. ØCompliance & Audits •Prepare evidence for customer audits, IATF/ISO, and internal audits •Ensures compliance to change control management. ØCross‑Functional Leadership •Partner with Production, Equipment, Quality, PE, NPI, Planning, SQE to ensure output, OEE, quality and delivery goals.
Qualifications
•Education oBachelor’s degree in Engineering (Industrial, Mechanical, Electronics, Chemical or related engineering field). •Experience o10+ years of semiconductor manufacturing experience, with ≥8 years dedicated to solder die attach / clip attach process for module packages. oHands‑on with die bonders/reflow platforms (ASM, ESEC or equivalent) and high‑mix, high‑reliability products. oProven track record in capability studies (Cp/Cpk), and DOE. •Skills and Knowledge Requirement •Deep understanding of solder metallurgy, wetting, void mechanisms, thermal management, surface finishes (ENIG/ENEPIG/Ag/Pd). •Strong in SPC, MSA/GR&R, PFMEA, Control Plans and engineering documentation. •Proficient in data analysis (e.g., Minitab/Exensio/Excel) and interpreting bonding diagrams/ engineering drawings. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.