Company:

Qualcomm India Private Limited

Job Area:

Engineering Services Group, Engineering Services Group > PWB Design

General Summary:

Job DescriptionThe successful candidate will operate as a member of the Corporate Engineering unit, PWB CAD department, and will be able to provide PWB design solutions for a variety of design types. For example: Product Test Engineering (PTE) designs - (UFLEX/IFLEX Probe cards, 93K DIB, Bench boards and Daughter Cards, Socketed and Solder down, HTOL, etc.) with multiple DUT sites up to 32X. Emulator designs - large/high density digital designs having high layer counts (24-34 layers) and containing several FPGA's (>1500 pins) along with very high-speed digital signals. Reference handset designs - 'form factor accurate' (FFA) circuit boards. These boards require mastery in digital processors, RF and radio circuits as well as power control devices. Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .5mm pitch and smaller packages. Responsibilities include working with US and India teams to provide PWB design solutions for high performance electronic assemblies for Mobile, Modem and IOT. Specific tasks include daily use of PWB CAD design software to perform placement and routing activities to meet mechanical and electrical design constraints and requirements. Exchange of electronic file transfers to/from mechanical and electrical engineers to ensure compliance to fit, form and function as well as power and signal integrity requirements. Creating fabrication and assembly drawings and working with internal teams and external suppliers to support PWB fabrication and assembly. The candidate will interface with internal staff and outside partners in the fast-paced execution of a variety of multi-disciplined projects. Leadership skills are expected on all projects to help direct, capture and interface with outside consultants.The candidate is expected to have proficiency on Mentor Xpedition, Mentor PADS and Cadence Allegro PWB design software and is expected to have multiple years of experience in developing PWB design solutions for a variety of design types and working with internal teams and external suppliers to support PWB fabrication and assembly.Minimum Qualifications:•   Associate's degree in Electrical Engineering, Computer Science, Mathematics, or related field and 5+ years of PCB layout handling or related work experience.ORHigh School diploma or equivalent and 7+ years of PCB layout handling or related work experience.Additional Job Description6-9 years actively involved in PWB design for high-density electronics packaging.6-9 years experience in a PWB design role designing consumer-grade mobile phones utilizing latest generation processor chips.Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.

Design experience: RF, Analog, High-speed digital circuits - DDR2, 3 & 4, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE, ATE Platforms: 93K, uFlex and iFlex.Expected to possess a strong understanding and demonstrated application of PWB design principles, practices and standards.Able to perform complex and difficult PWB design tasks requiring extensive skill and knowledge of fabrication and assembly process capabilities and limitations.Develops solutions to a variety of complex problems and proposes PWB design trade-offs to the engineering design team for resolution and implementation.Determine PWB design trade-offs necessary to meet design requirements and produce high quality cost effective PWBs that meet schedule objectives.Understands the requirements driving PWB technology and process trends and their application to Qualcomm designs.Maintain technical coordination with Engineering and Manufacturing. Resolve PWB design issues with fabrication and assembly vendors.Participate and provide input into process improvement, PWB and DFM checklists and guidelines.Participates in determining objectives of assignment and plans, schedules and arranges own activities in accomplishing objectives.Experience working with on-board EMI shielding cans.Experience with IDF/EMN file exchange between mechanical and HW teams.Understands project goals and individual contribution toward those goals.Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.Interact and collaborate with other internal PWB designers for optimal product development processes and schedule execution.Effectively multitasks and meets aggressive schedules in a dynamic environment.Prepare and deliver design reviews to project team.Possess excellent verbal and written communication skills.Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members.

Minimum Qualifications:

•    Associate's degree in Electrical Engineering, Computer Science, Mathematics, or related field and 5+ years of PCB layout handling or related work experience.
OR
High School diploma or equivalent and 7+ years of PCB layout handling or related work experience.

Applicants

: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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