Imagine what you could accomplish here. At Apple, innovative ideas rapidly evolve into industry-defining products. Do you have the drive and technical depth to make a meaningful impact? The engineers who work here have transformed entire industries through Apple Hardware innovations. That same rigor and creativity also guide our design methodologies — continually advancing performance, reliability, and sustainability across every generation of our products. As a core member of our best-in-class CAD organization, you will help shape next-generation electromagnetic analysis methodologies for advanced RFIC and multi-die designs. You will apply first-principles understanding of Maxwell’s equations and field theory to develop and validate EM simulation flows using Finite Element and Method of Moments techniques. Your work will involve modeling complex package and interposer structures, enabling high-accuracy extraction of S-parameters, and ensuring robust signal integrity, coupling, and shielding performance across advanced packaging and 3DIC systems. Join our team of world-leading engineers and contribute to the development of groundbreaking technologies that power the next generation of Apple products.