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Lam Research

Mechanical Engineer 3

ORSalary not listedPosted 36 days ago

Immigration summary

Visa sponsorship

Highly likelyHigh confidence

This employer sponsors this kind of work repeatedly, and is still filing this year.

228 recent H-1B filings · 13 similar-role filings

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Green card sponsorship

Strong historyHigh confidence

This employer has recently sponsored green cards at scale.

75 recent certified PERM filings · 9 similar-role filings

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Job description

The group you’ll be a part of

You’ll be joining the WETS Product Group, a highly collaborative, cross‑disciplinary organization within Lam’s Global Products Group (GPG), focused on delivering industry‑leading wet processing solutions for advanced semiconductor manufacturing. The WETS organization develops liquid‑based process equipment supporting both wafer and panel‑level applications, with a strong emphasis on new product introduction (NPI), technology differentiation, and manufacturing scalability. Our teams work closely across mechanical, electrical, controls, software, systems, and process engineering, partnering globally to bring complex, high‑performance tools from concept through production while meeting aggressive cost, schedule, and quality targets.

The impact you’ll make

As a Mechanical Engineer III in the WETS Product Group, you will contribute directly to the design, development, and delivery of next‑generation wet processing equipment for advanced semiconductor manufacturing. Your work will support critical New Product Introduction (NPI) programs, shaping mechanical designs that meet performance, reliability, cost, and manufacturability goals. In this role, you will translate system‑level and subsystem requirements into robust mechanical solutions, working closely with Systems, Process, Electrical, Controls, and Manufacturing Engineering partners. Your contributions will help reduce development risk, accelerate schedules, and enable high‑quality products to reach customers on time. This is an execution‑focused role with meaningful ownership, where strong fundamentals and good engineering judgment make a visible impact on product success.

What you’ll do

  • Design and develop mechanical components, assemblies, and subsystems for complex semiconductor manufacturing equipment.
  • Translate system‑ and subsystem‑level requirements into detailed mechanical designs, layouts, and drawings.
  • Create and maintain 3D CAD models, detailed drawings, and engineering documentation in accordance with Lam standards.
  • Perform engineering analysis (e.g., tolerance analysis, thermal‑mechanical considerations, structural integrity) to support design decisions.
  • Collaborate with cross‑functional teams including Systems, Process, Electrical, Controls, Software, and Manufacturing Engineering to ensure successful subsystem integration.
  • Support prototype build, system integration, debug, and validation activities related to New Product Introduction (NPI) projects.
  • Support New Product Introduction (NPI) phase‑gate activities (Preliminary Design Review (Pre‑DR), Detailed Design Review (DDR), Critical Design Review (CDR), and Final Design Review (FDR)) by delivering assigned mechanical design milestones on schedule.
  • Participate in design reviews, risk assessments, and failure analysis, contributing to Design Failure Mode and Effects Analysis (DFMEA) and corrective action efforts.
  • Work with Manufacturing Engineering and Supply Chain partners to ensure designs are manufacturable, serviceable, and cost‑effective.
  • Contribute to sustaining engineering efforts and field issue resolution as needed.
  • Mentor junior engineers in the performance of their assigned tasks.

Who we’re looking for

  • Bachelor’s degree in Mechanical Engineering or a related discipline with a minimum of 5 years of relevant engineering experience; or 3+ years with a Master’s degree; or equivalent practical experience.
  • Solid foundation in mechanical design principles, materials, and manufacturing processes.
  • Experience creating detailed mechanical designs using 3D CAD tools (e.g., Creo, NX).
  • Ability to read and interpret system requirements, drawings, and interface documentation.
  • Strong problem‑solving skills and attention to detail.
  • Effective written and verbal communication skills.
  • Ability to work productively in a collaborative, fast‑paced, New Product Introduction (NPI) environment.

Preferred qualifications

  • Experience with semiconductor manufacturing equipment or other complex electro‑mechanical systems.
  • Familiarity with wet processing, fluid handling/fluidic system design, thermal management, and chemical‑compatible mechanical design.
  • Exposure to New Product Introduction (NPI) development processes, phase‑gate reviews, or prototype builds.
  • Experience supporting production ramp or working with global suppliers.
  • Knowledge of Design for Excellence (DFx) principles (reliability, manufacturability, serviceability, safety).
  • Interest in technical growth toward senior engineering roles.

Our commitment

We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.

Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.

Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.

#LI-JA1

Our Perks and Benefits

At Lam, our people make amazing things possible. That’s why we invest in you throughout the phases of your life with a comprehensive set of outstanding benefits.

Sponsorship evidence

Why Openbound reached the conclusions above.

Visa sponsorship evidence

Current posting

Silent on sponsorship

Other openings

1 of 1210 recent openings at this employer mention sponsorship.

Employer H-1B history

228
recent certified H-1B filings
130
new-hire petitions
13
filings for similar roles
216
so far in FY2026

Filed titles like this role: mechanical engineer · mechanical design engineer

More evidence details
  • 13 certified H-1B filings for this same role, 130 new-hire petitions across the employer, and 134 new hires already this year
  • 13 certified H-1B filings for this same role
  • 228 recent certified H-1B filings across the employer
  • Still filing this year — 216 filings in FY2026
  • 141 USCIS H-1B new-employment approvals, counted separately from LCA filings
  • Strong filing activity in OR
  • 1 other recent posting at this company mention sponsorship
  • 338 further USCIS approvals for extensions or transfers
  • The posting says nothing about sponsorship either way

Strong filing activity in OR.

Green card sponsorship evidence

Employer PERM history

75
recent certified PERM filings
9
filings for similar roles
16
filings in this location
Certified PERM filings by fiscal year
202355
202454
202595
202658YTD

Filing history reflects past employer behavior; it isn't a promise for this opening.

All open roles at Lam Research
How Openbound evaluates sponsorship

Visa history uses official U.S. Department of Labor H-1B LCA disclosure data and USCIS H-1B petition history. Green card history uses DOL PERM disclosure data. Each is read for the employer as a whole, for roles like this one, and for this location, weighted toward the most recent fiscal years.

An employer is matched to its filing entities by verified legal name and reviewed aliases; a match is never made on a name resemblance alone. Where no verified entity can be matched, the page says so and draws no conclusion from the absence. 136 filing titles were examined for this employer.

What this posting states outranks history in both directions, and an employer's published policy outranks past filings. Filing history reflects past behavior; it is not a promise of sponsorship for this opening, and none of this is legal advice.