ON Semiconductor
ENGR I, MANUFACTURING EQUIP; MFG
Job description
Responsible for supporting Assembly manufacturing equipment, driving equipment reliability and leading New Product Introduction (NPI) activities for new package and product development.
Responsibilities
- Support assembly equipment uptime, OEE and maintenance programs.
- Lead equipment qualification and readiness for NPI programs.
- Coordinate with Process, Product, Quality and Manufacturing teams.
- Develop machine recipes, tooling and process parameters.
- Support DOE, process characterization and improvement projects.
- Drive yield, cycle time and productivity improvements.
- Maintain engineering documentation and compliance requirements.
Qualifications
- Bachelor Degree in Engineering.
- 3–5 years semiconductor assembly experience.
- Experience with Die Attach, Wire Bond, Sintering, Molding, Singulation or related equipment.
- Familiar with SPC, FMEA, 8D and DOE methodologies.
- Strong analytical and communication skills.
onsemi
(Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.