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HP10K+ employees

PWI R&D Writing Systems Engineer

Corvallis, OR$93,400 – $135,400Posted 6 days ago

Immigration summary

Visa sponsorship

LikelyMedium confidence

This employer has recently sponsored work like this.

187 recent H-1B filings

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Green card sponsorship

Strong historyHigh confidence

This employer has recently sponsored green cards at scale.

47 recent certified PERM filings · 15 similar-role filings

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Job description

PWI R&D Writing Systems Engineer

Description -

A Writing Systems Engineer is an experience individual contributor responsible for owning system-level performance of industrial inkjet web presses, with a strong emphasis on hands-on engineering, on-press troubleshooting, and technical leadership.

This role leads complex problem solving across ink, printhead, media, firmware, and mechanical systems, driving print quality, reliability, and robustness through a combination of deep systems thinking and direct experimentation. The specialist serves as a key decision-maker in resolving ambiguous, cross-functional issues and ensuring successful product delivery.

Responsibilities

Hands-on system ownership & advanced troubleshooting (Primary)

  • Serve as the technical owner for system-level performance, including print quality, reliability, and production robustness
  • Lead hands-on troubleshooting on industrial web presses, diagnosing complex print defects (banding, mottle, nozzle behavior, edge effects, etc.)
  • Design and execute on-press experiments (DOEs) to isolate root causes and quantify system sensitivities
  • Drive root cause analysis across subsystems (ink formulation, printhead, firmware, mechanics, media) and implement corrective actions
  • Support press bring-up, ramp, customer escalations, and field issues, often in high-pressure situations requiring rapid, data-driven decisions
  • Translate real-world press behavior into actionable engineering insights and design improvements

System design & integration leadership

  • Define and develop system-level solutions to optimize ink/media interactions, printhead performance, and image quality
  • Lead integration of subsystems (ink, printheads, media, firmware, mechanical systems) into a robust, high-performing writing system
  • Establish system requirements, performance targets, and tradeoffs across quality, reliability, and cost

Testing strategy & validation

  • Define comprehensive test strategies and validation plans for system performance (IQ, durability, reliability)
  • Architect and guide execution of experiments, ensuring high-quality data and clear conclusions
  • Establish and evolve system-level metrics and characterization methods

Performance optimization & technical depth

  • Apply advanced data analysis and modeling to improve system performance and robustness
  • Identify key sensitivities and failure modes, driving design changes across subsystems
  • Balance competing requirements (print quality, throughput, cost, manufacturability)

Cross-functional technical leadership

  • Act as the system-level authority across R&D, manufacturing, quality, and field teams
  • Provide clear technical direction and influence design decisions across disciplines
  • Mentor junior engineers and guide team problem-solving approaches
  • Communicate complex technical issues, risks, and recommendations to leadership and stakeholders

Program execution & ownership

  • Lead system-level aspects of NPI programs, from concept through qualification and release
  • Define technical milestones, risks, and mitigation strategies
  • Drive closure of critical issues impacting product readiness and customer satisfaction

Education & Experience Recommended

  • Four-year or Graduate Degree in Mechanical, Chemical, Electrical, Materials Engineering, Physics, or any other related discipline or commensurate work experience or demonstrated competence.
  • Typically has 4-7 years of work experience, preferably in inkjet writing systems, or a related field or an advanced degree with 3-5 years of work experience.

Knowledge & Skills

• Extensive experience in hands-on engineering, system integration, and troubleshooting of complex products

• Strong expertise in fluidics, heat transfer, materials, and/or electro-mechanical systems

• Proven ability to lead root cause analysis and DOE-driven problem solving

• Experience with industrial inkjet, imaging systems, or printing technologies strongly preferred

• Proficiency in data analysis tools (Python, MATLAB, JMP, etc.)

Cross-Org Skills

  • Effective Communication
  • Results Orientation
  • Learning Agility
  • Digital Fluency
  • Customer Centricity

Impact & Scope

• Impacts multiple teams and may act as a team or project leader providing direction to team activities and facilitates information validation and team decision making process.

Complexity

• Responds to moderately complex issues within established guidelines.

Disclaimer

• This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.

Compensation and Benefits:

The pay range for this role is $93,400.00 - 135,400.00 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:

  • Health insurance
  • Dental insurance
  • Vision insurance
  • Long term/short term disability insurance
  • Employee assistance program
  • Flexible spending account
  • Life insurance
  • Generous time off policies, including;
  • 4-12 weeks fully paid parental leave based on tenure
  • 11 paid holidays
  • Additional flexible paid vacation and sick leave (US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

Relocation -

Equal Opportunity Employer (EEO) -

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"

Sponsorship evidence

Why Openbound reached the conclusions above.

Visa sponsorship evidence

Current posting

Silent on sponsorship

Employer H-1B history

187
recent certified H-1B filings
117
new-hire petitions
0
filings for similar roles
184
so far in FY2026

Filed titles like this role: software applications engineer · software applications engineer 4 · software applications engineer 5 · software dev ops engineer 3

More evidence details
  • 69 certified H-1B filings for closely related roles, though none for this exact title
  • 187 recent certified H-1B filings across the employer
  • Still filing this year — 184 filings in FY2026
  • 70 USCIS H-1B new-employment approvals, counted separately from LCA filings
  • Strong filing activity in OR
  • 220 further USCIS approvals for extensions or transfers
  • The supporting filings are for related work, not for this exact role
  • The posting says nothing about sponsorship either way

Strong filing activity in OR.

Green card sponsorship evidence

Employer PERM history

47
recent certified PERM filings
15
filings for similar roles
3
filings in this location
Certified PERM filings by fiscal year
202332
202443
202556
202640YTD

Filing history reflects past employer behavior; it isn't a promise for this opening.

All open roles at HP
How Openbound evaluates sponsorship

Visa history uses official U.S. Department of Labor H-1B LCA disclosure data and USCIS H-1B petition history. Green card history uses DOL PERM disclosure data. Each is read for the employer as a whole, for roles like this one, and for this location, weighted toward the most recent fiscal years.

An employer is matched to its filing entities by verified legal name and reviewed aliases; a match is never made on a name resemblance alone. Where no verified entity can be matched, the page says so and draws no conclusion from the absence. 237 filing titles were examined for this employer.

What this posting states outranks history in both directions, and an employer's published policy outranks past filings. Filing history reflects past behavior; it is not a promise of sponsorship for this opening, and none of this is legal advice.