Company:

Qualcomm India Private Limited

Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

• Drive the Physical Design lifecycle of chip development with a strong focus on Floorplanning, Placement, Clock Tree Synthesis (CTS), Routing, and Physical Signoff.
• Own and execute block-level and SoC-level floorplanning activities using Cadence Innovus, including:
  • Macro planning and placement
  • Power planning (rings, straps, grids)
  • Pin assignment and I/O planning
  • Floorplan optimization for PPA (Power, Performance, Area)
  • Congestion and routability analysis
  • Hierarchical integration and partitioning strategies
• Perform hands-on Physical Design implementation and drive PPA improvements through floorplan and implementation optimizations.
• Develop deep understanding of process technologies and Physical Design methodologies and contribute to flow enablement for advanced technology nodes.
• Provide tool support, debugging, and methodology guidance to Physical Design engineers across global teams.
• Develop and maintain automation, productivity enhancements, and third-party tool integrations using Tcl/Python.

• Strong hands-on expertise in Floorplanning using Cadence Innovus is mandatory.
• Proven experience in:
  • Block/Subsystem/SoC floorplanning
  • Macro placement optimization
  • Power planning and grid design
  • Pin and interface planning
  • Congestion analysis and mitigation
  • Physical hierarchy and partitioning
  • Floorplan-driven PPA optimization
• Strong understanding of complete Physical Design flows using Innovus, Fusion Compiler (FC), ICC2, or equivalent P&R tools.
• Hands-on scripting proficiency in Python, Tcl, and/or C++.
• Good understanding of advanced-node implementation challenges and Physical Design methodologies.
• Ability to quickly learn new technologies, work effectively in cross-functional teams, and communicate technical concepts clearly.

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

Experience

• 3–5 years of hands-on Physical Design experience, with significant exposure to floorplanning and implementation using Cadence Innovus.
• Experience in advanced technology node designs and full-chip/block-level physical implementation is highly desirable.
• Demonstrated experience in floorplan convergence, congestion closure, timing closure, and power-aware design implementation.

Preferred/Niche Skills

Handling support tools like Encounter/Innovus/edi/fc/Icc2 (or other equivalent PNR tool). One or more of the above is mandatory*

Applicants

: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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