Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.

About the Role

We are seeking an experienced Director of Design for Test (DFT) to lead our DFT engineering efforts for the Scorpio family of PCIe switch products. In this critical leadership role, you will define and execute the DFT strategy for complex, high-speed SerDes-based switching solutions, ensuring optimal testability, yield, and quality while enabling cost-effective manufacturing at scale. This role requires deep expertise in advanced packaging technologies including 2.5D and 3D integration, as our products leverage cutting-edge multi-die architectures.

Key Responsibilities

DFT Strategy & Leadership

• Define and drive the comprehensive DFT strategy for PCIe Gen3/4/5/6 switch products with 2.5D/3D packaging
• Lead and mentor a team of DFT engineers across multiple product development cycles
• Collaborate with design, verification, packaging, and product engineering teams to optimize test coverage and manufacturing cost
• Establish DFT best practices, methodologies, and flows for complex multi-billion transistor designs in advanced packaging configurations

Advanced Packaging DFT Architecture

• Develop DFT strategies for 2.5D/3D heterogeneous integration architectures:
• Multi-die test access and coordination through silicon interposers
• Through-Silicon Via (TSV) testing and characterization
• Die-to-die interface testing and Known Good Die (KGD) strategies
• Chiplet-level DFT with system-level test integration
• Hybrid bonding and micro-bump interconnect testing
• Architect test access mechanisms for:
• Inter-die communication channels and high-bandwidth interfaces
• HBM/DRAM interfaces in 2.5D configurations
• Power delivery network testing across multiple dies
• Thermal and reliability test structures
• Define pre-bond and post-bond test strategies:
• Individual die screening and KGD qualification
• Stack-level testing for 3D integrated circuits
• Package-level test optimization and cost reduction

Technical Execution

• Architect and implement advanced DFT features including:
• Scan insertion, ATPG, and compression strategies for multi-die systems
• Memory BIST (MBIST) for embedded SRAM and register files
• Logic BIST (LBIST) for at-speed testing
• IEEE 1149.1 (JTAG) and IEEE 1687 (IJTAG) for die-level and package-level access
• IEEE 1838 (3D-DFT) standards for 3D stacked die test
• High-speed SerDes BIST and loopback testing across die boundaries
• Analog/mixed-signal test hooks and observability
• Built-in Self-Repair (BISR) for redundancy management
• Drive fault coverage targets (>99% stuck-at, >95% transition) across all dies
• Optimize test time and ATE costs while maintaining quality metrics
• Define and implement production test programs and diagnostic capabilities for packaged devices

Cross-Functional Collaboration

• Partner with physical design and packaging teams to optimize DFT area, timing, and package routing impact
• Work with silicon validation teams to enable post-silicon debug and characterization of multi-die systems
• Collaborate with manufacturing, assembly, and test engineering for seamless production ramp
• Interface with OSAT partners, substrate vendors, and ATE vendors
• Coordinate with design teams on die partitioning and test accessibility planning

Quality & Reliability

• Define test coverage metrics and quality goals for multi-die products
• Implement diagnostic and failure analysis capabilities for complex packaging failures
• Support yield enhancement and defect reduction initiatives across die and package
• Establish field return analysis and root cause investigation processes
• Develop screening strategies for infant mortality and reliability issues

Required Qualifications

Education & Experience

• MS or PhD in Electrical Engineering, Computer Engineering, or related field
• 12+ years of experience in DFT engineering with complex SoC/ASIC products
• 5+ years of hands-on experience with 2.5D and/or 3D packaging DFT strategies
• 5+ years in technical leadership or management roles
• Proven track record of multiple successful tape-outs with high-volume production
• Experience taking multi-die products from design through production ramp

Technical Expertise

• Deep expertise in DFT methodologies and industry standards
• Strong background in 2.5D/3D packaging technologies:
• Silicon interposer-based designs
• TSV technology and testing
• Chiplet architectures and die-to-die interfaces
• Known Good Die (KGD) test strategies
• CoWoS, EMIB, or similar advanced packaging platforms
• Understanding of JEDEC standards for multi-die testing (e.g., JESD229, JESD235)
• Experience with DFT EDA tools (Synopsys DFT Compiler, TetraMAX, DFTMAX, Mentor Tessent, etc.)
• Strong understanding of ASIC design flow from RTL to GDS
• Knowledge of high-speed SerDes architectures and testing requirements
• Familiarity with ATE platforms (Advantest, Teradyne) and test program development for advanced packages
• Understanding of production test economics and yield analysis for multi-die products
• Experience with IEEE 1149.1, IEEE 1687 (IJTAG), and IEEE 1838 (3D-DFT) standards

Leadership & Communication

• Proven ability to build, lead, and mentor high-performing engineering teams
• Excellent communication skills with ability to influence across organizations
• Strategic thinking with strong execution and problem-solving capabilities
• Experience managing projects with competing priorities and tight schedules
• Ability to work effectively with external partners (OSATs, packaging vendors)

Preferred Qualifications

• Experience with PCIe, CXL, or other high-speed serial protocols
• Background in SerDes architecture and testing
• Experience with HBM (High Bandwidth Memory) testing in 2.5D packages
• Knowledge of chiplet-based system architectures (UCIe, BoW, AIB)
• Familiarity with 3D stacking technologies (face-to-face, face-to-back bonding)
• Experience with wafer-level testing and probe strategies for advanced packages
• Familiarity with functional safety requirements (ISO 26262) or automotive quality standards
• Experience with machine learning approaches to test optimization
• Understanding of PCIe/CXL link training, equalization, and state machines
• Prior experience in networking or switch product development
• Knowledge of thermal and power integrity considerations in 3D packages
• Experience with DTCO (Design-Technology Co-Optimization) for advanced nodes and packaging

This position can be hired as a Director Level. The base salary range is $230,000 USD – $265,000 USD. Your base salary will be determined based on location, experience, and employees' pay in similar positions.

We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.