External Manufacturing NPI Engineer

Responsibilities

• Own backend external manufacturing NPI from conceptualization, development, qualification to production launch  
• Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release       
• Interface & steer cross-functional team engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement to meet department objectives 
• Drive DFM, technology & manufacturability readiness for new package & complex derivative platforms for effective POR freeze to new product industrialization 
• Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include process flow & BOM setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release 
• Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
• Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
• Adoption of data analytics and data-driven approach to problem solving and decision making
• Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production 
• Participate in quality and process readiness audit to achieve production site readiness
• Co-work with operations to drive continuous yield improvement for evolving challenges
• Subject Matter Expert to address arising package and assembly challenges

Qualifications

• Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
• More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience
• Hands-on assembly process experience in leading wafer technology such as SiC, GaN and CIS Imaging is highly desirable  
• Hands-on experience in wafer-level packaging (WLP), bumping and post-fab solutions including electroless & electrolytic plating and other surface finishing technology will be advantageous   
• Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
• Strong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings
• Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
• Proficient in statistical analysis methods and familiar with data analytics  
• Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous 

onsemi

(Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits