Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

This position is part of Qualcomm's Integrated Circuits (IC) Packaging organization and represents a senior leadership role within the Mechanical Simulation function. The Director will lead a team of engineers responsible for delivering FEA-based mechanical simulation solutions in support of Qualcomm's current and next-generation chipsets and advanced packaging technologies.

The Director will drive strategic alignment across IC package design/architecture, New Product Introduction (NPI), assembly, and Chip-Package Interaction (CPI) teams, ensuring high-quality mechanical simulation support across High Volume Manufacturing (HVM) and advanced packaging programs. This leader will be accountable for setting team direction, developing talent, managing cross-functional stakeholder relationships, and advancing simulation methodology and best practices.

Core technical responsibilities include overseeing the development and validation of mechanical FEA models (ANSYS APDL), establishing BKM methodology for test correlation and material characterization, and guiding stress/mechanical analysis for IC package designs. Simulation scope includes Warpage, Solder Joint Reliability (SJR), package assembly process simulation, Board Level Reliability (BLR), and Chip-Package-Board interaction. The Director is expected to champion innovation in simulation workflows, automation, and tooling to improve team efficiency and scalability.

All Qualcomm employees are expected to actively support diversity on their teams and in the Company.

Minimum Qualifications:

•    Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.

Preferred Qualifications:

• Ph.D. in Mechanical Engineering, Materials Science, Electrical/Microelectronics Engineering, or related field
• 12+ years of combined experience in Finite Element modeling and analysis for IC electronic packaging and interconnects
• 5+ years of direct people management, with experience managing managers or senior technical staff
• Proven track record of building and scaling high-performing simulation or engineering teams
• Deep expertise in IC electronic packaging structures, assembly processes, reliability testing and analysis, CPI, Package-Board interaction, and DOE
• Strong background in electronic packaging materials and thermo-mechanical behavior
• Experience establishing simulation BKMs, methodologies, and automation frameworks (e.g., APDL macros, OptiSLang, scripting/automation pipelines)
• Experience with material testing for strength and fracture, including designing and executing mechanical test methods
• Demonstrated experience presenting technical roadmaps and simulation strategies to executive and customer audiences
• Publications or patents in FEA predictive modeling, Warpage/SJR, and/or interfacial fracture testing (plus)
• Experience working with external customers or partners in a technical liaison or program leadership capacity
• Excellent communication, influencing, and cross-functional collaboration skills
• Ability to manage competing priorities across multiple programs and business units
• Demonstrated ability to lead cross-functional technical programs and influence at senior levels

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range

and Other Compensation & Benefits:

$227,200.00 - $340,800.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm.  We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus).  In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.