Memory Circuit Design Engineer
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1,172 recent certified PERM filings · 93 similar-role filings
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Job Details:
Job Description:
The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.
The Advanced Design (AD) team is part of Intel's larger Design Technology Platform (DTP) Organization and is focused on pathfinding and development of advanced memory technology. These circuits enable best-in-class memory collateral, IP and innovative product design across all generations of Intel process technology. At Intel, DTP is one of the key pillars enabling Intel to deliver winning products in the marketplace. Your work will directly enable Intel's internal and external customers to get to the market faster with products that include high-performance, high-density, low-power memory at the leading edge of the technology curve and implemented in Intel's advanced CMOS process technologies.
You will be partnering with and leveraging domain experts across various areas of technology development, EDA vendors and product design teams to develop and deliver high-quality industry-leading memory technology collaterals and to drive circuit innovations that enable next generation high-performance, high-density, low-power embedded memory designs on Intel advanced CMOS process technologies. In this position your responsibilities will include, but may not be limited to:
- Memory pathfinding activities and power, performance and area (PPA) optimization through design technology co-optimization (DTCO) and product design enablement.
- Memory bit-cell and complex periphery IC layout and automation.
- Memory array/IP design, memory circuit innovation, test-chip design.
- Pre-Si verification, post-Si validation and debugging to enable yield and parametric tracking/ramp.
Qualifications:
You must possess the minimum qualifications listed below to interview for this position. Preferred qualifications are not required but may work to your advantage during the interview process.
Minimum Qualifications:
Master degree in Electrical Engineering, Computer Engineering, Electrical and Computer Engineering, or a related discipline, including 4+ years of professional experience gained through either internships or full-time employment Or a PhD in Electrical Engineering, Computer Engineering, Electrical and Computer Engineering, or a related discipline.
Technical Experience:
- Design, characterization, and verification of custom memory circuits such as SRAM, Register Files or ROM.
- Design trade-offs between power, performance, and area (PPA).
- Custom digital circuit design, simulation, layout design, and verification.
- Knowledge of EDA tools used for custom digital and memory circuit design.
Preferred Qualifications:
- PhD with 1-2 years of professional experience gained through either internships or full-time employment.
- Design technology co-optimization (DTCO).
- Post-Si validation experience.
- Knowledge of the CMOS ASIC design flow.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
US, Arizona, Phoenix, US, California, Santa Clara, US, Texas, Austin
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $122,440.00-232,190.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Sponsorship evidence
Why Openbound reached the conclusions above.
Visa sponsorship evidence
Current posting
Silent on sponsorship
Other openings
26 of 620 recent openings at this employer state a sponsorship restriction.
Employer H-1B history
- 2,446
- recent certified H-1B filings
- 1,203
- new-hire petitions
- 0
- filings for similar roles
- 1,731
- so far in FY2026
Filed titles like this role: graphics hardware engineer · analog engineer · firmware engineer · soc design engineer
More evidence details
- 202 certified H-1B filings for closely related roles, though none for this exact title
- 2,446 recent certified H-1B filings across the employer
- Still filing this year — 1,731 filings in FY2026
- 1,436 USCIS H-1B new-employment approvals, counted separately from LCA filings
- Strong filing activity in OR
- 5,689 further USCIS approvals for extensions or transfers
- 26 other recent postings at this company state a sponsorship restriction
- The supporting filings are for related work, not for this exact role
- The posting says nothing about sponsorship either way
Strong filing activity in OR.
Green card sponsorship evidence
Employer PERM history
- 1,172
- recent certified PERM filings
- 93
- filings for similar roles
- 405
- filings in this location
Filing history reflects past employer behavior; it isn't a promise for this opening.
All open roles at IntelHow Openbound evaluates sponsorship
Visa history uses official U.S. Department of Labor H-1B LCA disclosure data and USCIS H-1B petition history. Green card history uses DOL PERM disclosure data. Each is read for the employer as a whole, for roles like this one, and for this location, weighted toward the most recent fiscal years.
An employer is matched to its filing entities by verified legal name and reviewed aliases; a match is never made on a name resemblance alone. Where no verified entity can be matched, the page says so and draws no conclusion from the absence. 160 filing titles were examined for this employer.
What this posting states outranks history in both directions, and an employer's published policy outranks past filings. Filing history reflects past behavior; it is not a promise of sponsorship for this opening, and none of this is legal advice.