
Hardware Design & PCB Layout Engineer - Advanced Power Electronics
Immigration summary
Visa sponsorship
This employer sponsors this kind of work repeatedly, and is still filing this year.
766 recent H-1B filings · 7 similar-role filings
View visa evidenceGreen card sponsorship
This employer has recently sponsored green cards at scale.
158 recent certified PERM filings · 9 similar-role filings
View green card evidenceJob description
Job Description
Hardware Design & PCB Layout Engineer - Advanced Power Electronics
Job Description
This role is categorized as hybrid. This means the successful candidate is expected to report to Warren, MI location three times
The Role
In this role you will lead the development of next-generation inverter and power electronics hardware solutions for electric vehicle applications. You will utilize engineering tools, processes, and program management disciplines to successfully develop components and systems that meet vehicle program requirements while achieving key cost, performance, efficiency, quality, and timing targets.
Key Responsibilities
- Q3D or equivalent 2D/3D electromagnetic field-solver analysis for PCB and magnetics parasitics.
- High-frequency transformer, inductor, planar, and PCB-embedded magnetics design.
- Hands-on signal integrity (SI), power integrity (PI), and worst-case circuit analysis (WCA), including component tolerances and environmental variation.
- High-voltage PCB design practices, including creepage, clearance, insulation coordination, and partial-discharge considerations.
- Layout experience for fast-switching SiC or IGBT power stages, including gate-loop optimization and dv/dt, di/dt, and parasitic-inductance control.
- Automotive EMI/EMC design for high-power converters, including filtering, grounding, shielding, and CISPR 25 requirements.
- Coordination of PCB design with power modules, busbars, gate drivers, thermal interfaces, and mechanical packaging.
Lead advanced technology development for power electronics systems, including design, analysis, simulation, validation, and testing.
Develop advanced power converter hardware solutions that meet future EV performance, cost, reliability, and manufacturability requirements.
Create and support digital and analog hardware designs, including schematic development, PCB layout, simulation, and supporting documentation.
Develop PCB layouts for new and existing architectures, ensuring designs meet functional, manufacturability, signal integrity, power integrity, EMC, thermal, and mechanical requirements.
Perform component placement, trace routing, stack-up definition, and layout optimization for high-density, high-speed, and mixed-signal electronic designs.
Create, review, and verify PCB layouts through Design Rule Checks (DRC), Design for Manufacturability (DFM), and Design for Assembly (DFA) methodologies.
Utilize modeling, simulation, systems analysis, and optimization tools to ensure designs meet system-level requirements and interface considerations.
Collaborate closely with hardware designers, systems engineers, ECAD engineers, PCBA engineers, packaging engineers, manufacturing teams, and suppliers to optimize design performance and production readiness.
Required Qualifications
Bachelor of Science in Electrical Engineering
Minimum 5 years of professional experience in hardware design, PCB layout, or power electronics development.
Experience creating digital and analog hardware interfaces, including schematic capture, PCB layout, simulation, and engineering documentation.
Hands-on experience with PCB design and analysis tools such as Mentor Graphics/Xpedition, Altium, or equivalent ECAD platforms.
Experience conducting PCB layout verification activities, including DRC, DFM, and DFA reviews.
Strong problem-solving, communication, and project management skills.
Preferred Qualifications
10+ years of experience in PCB layout, hardware design, or power electronics development.
Experience with electric vehicle propulsion systems, inverters, converters, battery systems, or automotive ECUs.
Knowledge of high-speed communication interfaces including Ethernet, CAN, LIN, and automotive networking technologies.
Experience with high-density, high-speed, RF, or mixed-signal PCB layouts.
Familiarity with automotive development processes, functional safety, and product development lifecycle requirements.
Experience supporting manufacturing launches, supplier development, and production-ready PCB designs.
Demonstrated success driving cost reduction, performance optimization, and technology innovation initiatives.
Previous experience with HV power electronics, connectivity, or other complex automotive electronic systems.


GM does not provide immigration-related sponsorship for this role. Do not apply for this role if you will need GM immigration sponsorship now or in the future. This includes direct company sponsorship, entry of GM as the immigration employer of record on a government form, and any work authorization requiring a written submission or other immigration support from the company (e.g., H1-B, OPT, STEM OPT, CPT, TN, J-1, etc).

This role is categorized as hybrid. This means the selected candidate is expected to report to a specific location at least 3 times a week {or other frequency dictated by their manager}.

This job may be eligible for relocation benefits.


About GM
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We encourage interested candidates to review the key responsibilities and qualifications for each role and apply for any positions that match their skills and capabilities. Applicants in the recruitment process may be required, where applicable, to successfully complete a role-related assessment(s) and/or a pre-employment screening prior to beginning employment. To learn more, visit How we Hire.
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Sponsorship evidence
Why Openbound reached the conclusions above.
Visa sponsorship evidence
Current posting
Silent on sponsorship
Employer H-1B history
- 766
- recent certified H-1B filings
- 318
- new-hire petitions
- 7
- filings for similar roles
- 669
- so far in FY2026
Filed titles like this role: hardware engineer · hardware design engineer · hardware engineer - rf design · hardware engineer power design
More evidence details
- 7 certified H-1B filings for this same role, 318 new-hire petitions across the employer, and 376 new hires already this year
- 7 certified H-1B filings for this same role
- 766 recent certified H-1B filings across the employer
- Still filing this year — 669 filings in FY2026
- 135 USCIS H-1B new-employment approvals, counted separately from LCA filings
- Strong filing activity in MI
- 1,468 further USCIS approvals for extensions or transfers
- The posting says nothing about sponsorship either way
Strong filing activity in MI.
Green card sponsorship evidence
Employer PERM history
- 158
- recent certified PERM filings
- 9
- filings for similar roles
- 141
- filings in this location
Filing history reflects past employer behavior; it isn't a promise for this opening.
All open roles at General MotorsHow Openbound evaluates sponsorship
Visa history uses official U.S. Department of Labor H-1B LCA disclosure data and USCIS H-1B petition history. Green card history uses DOL PERM disclosure data. Each is read for the employer as a whole, for roles like this one, and for this location, weighted toward the most recent fiscal years.
An employer is matched to its filing entities by verified legal name and reviewed aliases; a match is never made on a name resemblance alone. Where no verified entity can be matched, the page says so and draws no conclusion from the absence. 1,034 filing titles were examined for this employer.
What this posting states outranks history in both directions, and an employer's published policy outranks past filings. Filing history reflects past behavior; it is not a promise of sponsorship for this opening, and none of this is legal advice.