Senior Design Automation Engineer
Immigration summary
Visa sponsorship
This employer has recently sponsored work like this.
116 recent H-1B filings
View visa evidenceGreen card sponsorship
This employer has recently sponsored green cards at scale.
12 recent certified PERM filings · 10 similar-role filings
View green card evidenceJob description
Annapurna Labs designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.
We are seeking a Senior Design Automation Engineer to join our hardware team and contribute to the physical design of advanced IC packages and PCBs for next-generation machine learning and data center ASICs.
In this role, you will develop automation to enable physical design teams to execute Package and PCB products from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.
Key job responsibilities
- Develop and deploy efficient design methodologies to support Package and PCB layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Evaluate industry EDA offerings and make recommendations for purchase and usage of advanced packaging features to design 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Deliver custom design automation to improve RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Contribute to cross-level teams for co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Develop data integration flows for co-design data across Package, PCB and SI/PI flows.
- Develop software in the following languages: Python, Skill, TCL. Utilize AI coding agents to speed development and iteration.
- Identify preferred methodologies to integrate physical verification checks (DRC, connectivity, shorts/opens) into physical design cycles.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout methodologies — impedance-controlled routing, power plane optimization, and critical net shielding.
About the team
Our team is dedicated to supporting new members. We have a broad mix of experience levels and tenures, and we’re building an environment that celebrates knowledge-sharing and mentorship. Our senior members enjoy one-on-one mentoring and thorough, but kind, code reviews. We care about your career growth and strive to assign projects that help our team members develop your engineering expertise so you feel empowered to take on more complex tasks in the future.
Basic qualifications
- Bachelor's degree in Computer Science, Computer Engineering, or Electrical Engineering
- 7+ years of experience working with physical design tools across Package and PCB domains: Allegro, APD, 3DICC, Expedition
- 10+ years of Automation experience for physical designs
Preferred qualifications
- Master's degree or Ph.D. degree in Electrical Engineering or related field
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.
USA, TX, Austin - 185,200.00 - 250,000.00 USD annually
Sponsorship evidence
Why Openbound reached the conclusions above.
Visa sponsorship evidence
Current posting
Silent on sponsorship
Other openings
1220 of 22213 recent openings at this employer state a sponsorship restriction.
Employer H-1B history
- 116
- recent certified H-1B filings
- 86
- new-hire petitions
- 0
- filings for similar roles
- 142
- so far in FY2026
Filed titles like this role: software development engineer · software dev engineer · software dev engineer i · software development engineer i
More evidence details
- 67 certified H-1B filings for closely related roles, though none for this exact title
- 116 recent certified H-1B filings across the employer
- Still filing this year — 142 filings in FY2026
- Strong filing activity in TX
- 1,220 other recent postings at this company state a sponsorship restriction
- The supporting filings are for related work, not for this exact role
- The posting says nothing about sponsorship either way
Strong filing activity in TX.
Green card sponsorship evidence
Employer PERM history
- 12
- recent certified PERM filings
- 10
- filings for similar roles
- 6
- filings in this location
Filing history reflects past employer behavior; it isn't a promise for this opening.
All open roles at AmazonHow Openbound evaluates sponsorship
Visa history uses official U.S. Department of Labor H-1B LCA disclosure data and USCIS H-1B petition history. Green card history uses DOL PERM disclosure data. Each is read for the employer as a whole, for roles like this one, and for this location, weighted toward the most recent fiscal years.
An employer is matched to its filing entities by verified legal name and reviewed aliases; a match is never made on a name resemblance alone. Where no verified entity can be matched, the page says so and draws no conclusion from the absence. 30 filing titles were examined for this employer.
What this posting states outranks history in both directions, and an employer's published policy outranks past filings. Filing history reflects past behavior; it is not a promise of sponsorship for this opening, and none of this is legal advice.