Process Integration Development Engineer - TD Defect Metrology
Immigration summary
Visa sponsorship
This employer sponsors this kind of work repeatedly, and is still filing this year.
2,446 recent H-1B filings · 589 similar-role filings
View visa evidenceGreen card sponsorship
This employer has recently sponsored green cards at scale.
1,172 recent certified PERM filings · 252 similar-role filings
View green card evidenceJob description
Job Details:
Job Description:
Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision.
Join us and build on our legacy of innovation and collaboration as we deliver world‑changing technology that improves the life of every person on the planet.
Life at Intel: https://jobs.intel.com/en/life-at-intel
As a Process Integration Development Engineer, you will play a pivotal role in advancing semiconductor technology by designing, executing, and analyzing experiments to enhance process performance. Using cutting-edge materials and equipment, you will develop integrated solutions to meet quality, reliability, and manufacturability requirements, driving technology transfer to high-volume manufacturing. Your work will directly contribute to optimizing outputs and shaping Intel's future innovations.
Joining Intel Foundry's Logic Technology Development (LTD), you will be part of a team focused on driving advancements in silicon process technology. LTD is at the forefront of sustaining Moore's Law by enabling world-class semiconductor manufacturing. The group collaborates across engineering disciplines to develop processes that meet Intel's high standards for yield, performance, and reliability, ensuring the delivery of groundbreaking technology to our customers.
Your responsibilities may include but not limited to:
- Plan and execute experiments to fully characterize processes throughout the development cycle and improve product performance.
- Develop and qualify materials and equipment to meet reliability, cost, and manufacturability requirements.
- Conduct feasibility studies and identify process solutions in collaboration with product and module engineering teams.
- Leverage big data analysis to identify and resolve process design weaknesses or manufacturing tool issues.
- Lead new product qualifications and ensure seamless technology transfers to high-volume manufacturing using the Copy Exactly methodology.
- Collaborate with development teams and material suppliers to align processes with technology roadmaps.
- Organize and present process solutions to engineering teams to address customer requests or resolve issues.
Qualifications:
Candidates must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. The experience listed below may be obtained through schoolwork, classes and project work, internships, military training, and/or work experience.
Minimum Qualifications
:
- Ph.D. in Computer Science, Physics, Materials Science and Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Nuclear Engineering, Optics, Chemistry, or a related field; OR a Master's degree in the aforementioned fields with 4+ years of engineering industry experience.
- Experience in materials characterization techniques such as SEM, TEM, Spectroscopy or other metrology tools.
- Experience with semiconductor processing fundamentals, including lithography, etching, polishing, chemical/physical reactions, or device physics.
- Experience in statistical or data analysis tools like MATLAB, JMP, or Excel, and familiarity with design of experiments (DOE) principles.
Preferred Qualifications:
- Proven experience in defect reduction or process integration within semiconductor manufacturing.
- Knowledge of Statistical Process Control (SPC) methods or advanced process controls (APC).
- Expertise in advanced transistor device structures and architectures, including fabrication processes.
- Proficiency in scripting languages (e.g., Python, Perl) or programming languages (e.g., SQL, C++).
- Strong communication skills and a collaborative mindset to foster trust and partnerships across engineering teams.
Take advantage of this opportunity to join Intel and shape the future of engineering. Apply today to be part of a team that drives industry-leading innovation and transformation.
Interview Tips: https://www.intel.com/content/www/us/en/jobs/hiring.html
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-219,550.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Sponsorship evidence
Why Openbound reached the conclusions above.
Visa sponsorship evidence
Current posting
Silent on sponsorship
Other openings
1 of 518 recent openings at this employer mention sponsorship.
Employer H-1B history
- 2,446
- recent certified H-1B filings
- 1,203
- new-hire petitions
- 589
- filings for similar roles
- 1,731
- so far in FY2026
Filed titles like this role: process engineer
More evidence details
- 589 certified H-1B filings for this same role, 1,203 new-hire petitions across the employer, and 878 new hires already this year
- 589 certified H-1B filings for this same role
- 2,446 recent certified H-1B filings across the employer
- Still filing this year — 1,731 filings in FY2026
- 1,436 USCIS H-1B new-employment approvals, counted separately from LCA filings
- Strong filing activity in OR
- 1 other recent posting at this company mention sponsorship
- 5,689 further USCIS approvals for extensions or transfers
- 24 other recent postings at this company state a sponsorship restriction
- The posting says nothing about sponsorship either way
Strong filing activity in OR.
Green card sponsorship evidence
Employer PERM history
- 1,172
- recent certified PERM filings
- 252
- filings for similar roles
- 405
- filings in this location
Filing history reflects past employer behavior; it isn't a promise for this opening.
All open roles at IntelHow Openbound evaluates sponsorship
Visa history uses official U.S. Department of Labor H-1B LCA disclosure data and USCIS H-1B petition history. Green card history uses DOL PERM disclosure data. Each is read for the employer as a whole, for roles like this one, and for this location, weighted toward the most recent fiscal years.
An employer is matched to its filing entities by verified legal name and reviewed aliases; a match is never made on a name resemblance alone. Where no verified entity can be matched, the page says so and draws no conclusion from the absence. 160 filing titles were examined for this employer.
What this posting states outranks history in both directions, and an employer's published policy outranks past filings. Filing history reflects past behavior; it is not a promise of sponsorship for this opening, and none of this is legal advice.