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Intel10K+ employees

Module Engineering PhD Intern Summer 2027

OR$120,898 – $120,902Posted 11 days ago

Immigration summary

Visa sponsorship

LikelyLow confidence

This employer sponsors, but not for roles like this one.

2,446 recent H-1B filings

View visa evidence

Green card sponsorship

Strong historyMedium confidence

This employer has recently sponsored green cards at scale.

1,172 recent certified PERM filings

View green card evidence

Job description

Job Details:

Job Description:

The Role and Impact

In this role, you will contribute to the development and optimization of manufacturing processes for a specific module within semiconductor production. You will work hands-on to sustain and improve manufacturing equipment, troubleshoot issues, and support qualification activities, all while collaborating with engineering teams to achieve production goals. This internship offers a unique opportunity to apply your academic knowledge, gain practical skills, and explore potential career paths in a dynamic and innovative environment.

Business group

As part of Intel Foundry Services, you will join a team that focuses on diffusion and implantation processes within semiconductor manufacturing. This group is dedicated to advancing technology and achieving excellence in production methodologies. By working collaboratively, the team supports Intel's broader mission of driving innovation and delivering high-quality solutions to meet global technological demands.

Key Responsibilities

  • Support the development and implementation of semiconductor manufacturing processes for a specific module.

  • Sustain and improve manufacturing equipment performance, ensuring operational efficiency and reliability.

  • Assist in equipment troubleshooting and qualification activities to meet production standards.

  • Collaborate with engineering teams to optimize process control methodologies and ensure production targets are achieved.

  • Apply statistical analysis and design experiments to enhance process reliability and throughput.

  • Gain hands-on experience in materials and device characterization techniques, such as SEM and TEM.

  • Contribute to the continuous improvement of process control systems and methodologies.

Qualifications:

Minimum Qualifications

  • Ph.D. degree in progress in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related STEM field of study.

  • Hands-on experience and or knowledge of semiconductor processing fundamentals, including lithography, etching, polishing, and deposition techniques.

  • Familiarity with statistical data analysis and design of experiments methodologies.

  • Experience in materials and physical device characterization, such as SEM or TEM.

Preferred Qualifications

  • Advanced transistor device structures and architectures including fabrication (Atomic Layer Deposition, Chemical Vapor Deposition, Rapid Thermal Annealing, Ion Implantation, Surface treatments and modification) with in-depth knowledge of semiconductor device physics and process integration.

  • Technical skills such as scripting languages (i.e., Python, JSL, Perl, TCL), or programming languages (i.e., SQL, C/C++, etc.) and statistical data analysis is a plus.

  • Semiconductor processing fundamentals (lithography, wet etch, dry etch, chemical and or mechanical polishing, etc.).

  • Design of experiments and data analysis expertise.

  • Expertise in Materials and physical device characterization (SEM, TEM, etc.) and fundamentals of semiconductor device testing.

  • Process control systems, methodologies, sources of variability, and statistics.

This internship provides a unique platform for growth, innovation, and collaboration. If you're passionate about advancing semiconductor technology while building hands-on expertise in a supportive environment, we encourage you to apply today.

Job Type:

Student / Intern

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Sponsorship evidence

Why Openbound reached the conclusions above.

Visa sponsorship evidence

Current posting

Silent on sponsorship

Other openings

26 of 620 recent openings at this employer state a sponsorship restriction.

Employer H-1B history

2,446
recent certified H-1B filings
1,203
new-hire petitions
0
filings for similar roles
1,731
so far in FY2026
More evidence details
  • 2,446 recent certified H-1B filings across the employer
  • Still filing this year — 1,731 filings in FY2026
  • 1,436 USCIS H-1B new-employment approvals, counted separately from LCA filings
  • Strong filing activity in OR
  • 5,689 further USCIS approvals for extensions or transfers
  • We checked 160 filing titles for this employer and none describe work like this role
  • 26 other recent postings at this company state a sponsorship restriction
  • The posting says nothing about sponsorship either way

Strong filing activity in OR.

Green card sponsorship evidence

Employer PERM history

1,172
recent certified PERM filings
0
filings for similar roles
405
filings in this location
Certified PERM filings by fiscal year
20231,799
20241,148
2025936
2026326YTD

Filing history reflects past employer behavior; it isn't a promise for this opening.

All open roles at Intel
How Openbound evaluates sponsorship

Visa history uses official U.S. Department of Labor H-1B LCA disclosure data and USCIS H-1B petition history. Green card history uses DOL PERM disclosure data. Each is read for the employer as a whole, for roles like this one, and for this location, weighted toward the most recent fiscal years.

An employer is matched to its filing entities by verified legal name and reviewed aliases; a match is never made on a name resemblance alone. Where no verified entity can be matched, the page says so and draws no conclusion from the absence. 160 filing titles were examined for this employer.

What this posting states outranks history in both directions, and an employer's published policy outranks past filings. Filing history reflects past behavior; it is not a promise of sponsorship for this opening, and none of this is legal advice.