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AMD

Sr. Physical Design Engineer

Santa Clara, CASalary not listedPosted 4 days ago

Immigration summary

Visa sponsorship

Not availableStated in this posting

This posting says it cannot offer visa sponsorship for this role.

564 of 764 recent openings here state a sponsorship restriction

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Green card sponsorship

Strong historyMedium confidence

This employer has recently sponsored green cards at scale.

160 recent certified PERM filings

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Job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD. 

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.

THE ROLE:

Join a team developing next-generation AI and high-performance computing silicon. In this role, you will lead and contribute to advanced-node physical design for complex ASIC and SoC products, driving implementation, timing closure, signoff, and design optimization across block, subsystem, and chip-level designs. Working closely with architecture, RTL, CAD, technology, and product engineering teams, you will help deliver high-quality silicon while advancing methodology, automation, and data-driven design solutions that improve power, performance, and area (PPA).

THE PERSON:

You are a hands-on physical design expert with a strong track record of solving complex implementation and timing challenges on advanced-node designs. You combine deep technical expertise with the ability to provide technical leadership, influence design decisions, mentor engineers, and collaborate effectively across globally distributed teams. You are detail-oriented, highly analytical, and thrive in fast-paced environments where ownership and innovation are valued.

KEY RESPONSIBLITIES:

  • Lead physical design activities across block, subsystem, and chip-level implementations.
  • Drive timing closure, signoff readiness, and PPA optimization for advanced-node designs.
  • Develop and enhance physical design methodologies, design flows, and automation solutions.
  • Perform static timing analysis, variation-aware timing analysis, and clock-tree optimization.
  • Define and execute engineering change (ECO) strategies throughout implementation and signoff.
  • Support formal verification, physical verification, and tapeout preparation activities.
  • Analyze design data and trends to improve design quality, predictability, and efficiency.
  • Collaborate with cross-functional engineering teams to achieve successful silicon delivery.
  • Contribute to AI-assisted and machine learning-driven design optimization initiatives.
  • Troubleshoot complex implementation challenges and develop scalable technical solutions.

PREFERRED EXPERIENCE:

  • Experience with ASIC physical design, implementation, and timing closure.
  • Experience working across block, subsystem, and chip-level design environments.
  • Strong knowledge of static timing analysis, clock-tree synthesis, signoff, and ECO methodologies.
  • Experience with industry-standard implementation tools such as Synopsys ICC2, Fusion Compiler, and/or Cadence Innovus.
  • Experience with timing, power, and signoff tools such as PrimeTime, PrimeTime PX, PrimeShield, RedHawk, Formality, or Conformal.
  • Advanced-node semiconductor design experience, including leading-edge process technologies.
  • Strong scripting and automation skills using TCL, Python, Perl, Pandas, or similar technologies.
  • Experience developing design flows, methodologies, and productivity-enhancing automation.
  • Exposure to machine learning, AI-assisted design optimization, or data-driven engineering workflows.
  • Experience with data analysis, database technologies, and design-quality metrics.

ACADEMIC CREDENTIALS:

  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field preferred.

This role is not eligible for visa sponsorship.

#LI-LC3

#LI-HYBRID

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position.  AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

Sponsorship evidence

Why Openbound reached the conclusions above.

Visa sponsorship evidence

Current posting

Sponsorship restriction stated

“Not eligible for sponsorship”

Detected directly from this job posting.

Other openings

564 of 764 recent openings at this employer state a sponsorship restriction.

Employer H-1B history

649
recent certified H-1B filings
269
new-hire petitions
0
filings for similar roles
491
so far in FY2026
More evidence details
  • 649 recent certified H-1B filings across the employer
  • Still filing this year — 491 filings in FY2026
  • 180 USCIS H-1B new-employment approvals, counted separately from LCA filings
  • 1,046 further USCIS approvals for extensions or transfers
  • We checked 146 filing titles for this employer and none describe work like this role
  • 564 other recent postings at this company state a sponsorship restriction
  • No filing activity is recorded for this job's location

Green card sponsorship evidence

Employer PERM history

160
recent certified PERM filings
0
filings for similar roles
0
filings in this location
Certified PERM filings by fiscal year
20230
20242
2025255
2026105YTD

Filing history reflects past employer behavior; it isn't a promise for this opening.

All open roles at AMD
How Openbound evaluates sponsorship

Visa history uses official U.S. Department of Labor H-1B LCA disclosure data and USCIS H-1B petition history. Green card history uses DOL PERM disclosure data. Each is read for the employer as a whole, for roles like this one, and for this location, weighted toward the most recent fiscal years.

An employer is matched to its filing entities by verified legal name and reviewed aliases; a match is never made on a name resemblance alone. Where no verified entity can be matched, the page says so and draws no conclusion from the absence. 146 filing titles were examined for this employer.

What this posting states outranks history in both directions, and an employer's published policy outranks past filings. Filing history reflects past behavior; it is not a promise of sponsorship for this opening, and none of this is legal advice.