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ON Semiconductor10K+ employees

ENGR I, PROCESS; MFG (BACKEND)

MYSalary not listedPosted 2 days ago

Immigration summary

Visa sponsorship

LikelyHigh confidence

This employer has recently sponsored work like this.

112 recent H-1B filings · 1 similar-role filing

View visa evidence

Green card sponsorship

Some historyMedium confidence

This employer has recently sponsored green cards.

10 recent certified PERM filings

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Job description

Responsible for developing, sustaining, and improving QFN molding processes to achieve optimum product quality, manufacturing efficiency, yield, reliability, and cost performance. The engineer will lead process troubleshooting, continuous improvement activities, and new package/product qualifications related to mold operations.

Responsibilities

Responsibilities of QFN Mold Engineer

  • Own and sustain QFN molding processes to ensure stable production, high yield, and product quality.
  • Monitor and improve molding KPIs including yield, scrap rate, machine utilization, and cycle time.
  • Perform troubleshooting and root cause analysis for molding-related issues such as warpage, delamination, voids, package crack, mold flash, incomplete fill, and wire sweep.
  • Lead process optimization activities through DOE, statistical analysis, and continuous improvement methodologies.
  • Develop and maintain process specifications, OCAP, control plans, and engineering documentation.
  • Support new product introduction (NPI), package qualification, and material evaluations.
  • Drive yield improvement and cost reduction projects to enhance manufacturing performance.
  • Collaborate with Production, Quality, Equipment, and Maintenance teams to resolve process and equipment issues.
  • Review and qualify molding materials, tooling, and process changes.
  • Analyze process data and implement corrective and preventive actions (CAPA) to improve reliability and quality.
  • Provide technical coaching and guidance to technicians and operators.
  • Support customer audits, internal audits, and quality improvement initiatives.
  • Ensure compliance with safety, quality, and manufacturing standards.

Qualifications

degree holder in engineering field in Mechanical, electrical, mechatronics and materials

onsemi

(Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

Sponsorship evidence

Why Openbound reached the conclusions above.

Visa sponsorship evidence

Current posting

Silent on sponsorship

Other openings

7 of 697 recent openings at this employer state a sponsorship restriction.

Employer H-1B history

112
recent certified H-1B filings
76
new-hire petitions
1
filings for similar roles
96
so far in FY2026

Filed titles like this role: engr process tl

More evidence details
  • 1 certified H-1B filing for this same role
  • 112 recent certified H-1B filings across the employer
  • Still filing this year — 96 filings in FY2026
  • 13 USCIS H-1B new-employment approvals, counted separately from LCA filings
  • 78 further USCIS approvals for extensions or transfers
  • 7 other recent postings at this company state a sponsorship restriction
  • The posting says nothing about sponsorship either way
  • No filing activity is recorded for this job's location

Green card sponsorship evidence

Employer PERM history

10
recent certified PERM filings
0
filings for similar roles
Certified PERM filings by fiscal year
20238
20244
202515
202624YTD

Filing history reflects past employer behavior; it isn't a promise for this opening.

All open roles at ON Semiconductor
How Openbound evaluates sponsorship

Visa history uses official U.S. Department of Labor H-1B LCA disclosure data and USCIS H-1B petition history. Green card history uses DOL PERM disclosure data. Each is read for the employer as a whole, for roles like this one, and for this location, weighted toward the most recent fiscal years.

An employer is matched to its filing entities by verified legal name and reviewed aliases; a match is never made on a name resemblance alone. Where no verified entity can be matched, the page says so and draws no conclusion from the absence. 194 filing titles were examined for this employer.

What this posting states outranks history in both directions, and an employer's published policy outranks past filings. Filing history reflects past behavior; it is not a promise of sponsorship for this opening, and none of this is legal advice.