Module Engineer PVD
Immigration summary
Visa sponsorship
This employer sponsors, but not for roles like this one.
112 recent H-1B filings
View visa evidenceGreen card sponsorship
This employer has recently sponsored green cards.
10 recent certified PERM filings
View green card evidenceJob description
onsemi
is seeking a Module / Thin Films Engineer. In this role, you will work with the development and support the manufacturing of 300mm silicon wafers used for Automotive and Consumer applications throughout the world. You will also provide process engineering support for additional process areas. In this team-based environment, you will work closely with integration, process, and equipment teams to provide robust, quality products to our customers.
Responsibilities
Responsibilities:
- Own critical CVD and PVD processes and associated health of AMAT and LAM equipment in a fast-paced, 24/7 manufacturing environment.
- Apply technical skills to implement equipment and process improvements that increase product performance, reduce cost, and increase throughput and yield.
- Design and document experiments utilizing engineering methodology to improve yield, cost, and throughput.
- Resolve complex, time-sensitive technical problems to maintain production or development schedules.
- As a Thin Films Engineer, you will be expected to make decisions using data analysis and statistical process control (SPC) techniques.
- Provide daily support for process and product lot disposition in the furnace processing area.
- Contribute to the understanding and resolution of all equipment-level shifts in tool performance
- Within the first six to twelve months, develop advanced sustaining responsibilities and contribute to cost reduction, yield improvement, and production throughout increase.
Qualifications
Requirements:
- Education: BS degree in Engineering or another technical field. Advanced education/degree is a plus
- Experience: 2 years in semiconductor processing or a similar industry
- Knowledge of CVD and PVD processes with a focus on AMAT and LAM equipment
- Experience working in cross-functional teams to achieve goals and metrics
- Experience with FMEA risk analysis is a plus
- Intermediate-level data analysis skills, specifically in Excel or JMP, using formulas, pivots, and charts, are required
- Proficiency in Microsoft Office, particularly PowerPoint
- Strong communication skills with experience in presenting technical project details
- Self-motivated and results-oriented
- Fluency (written and oral) in English required
Salary: onsemi is excited to share the base salary range for this position is $65,800 to $102,100. exclusive of fringe benefits or potential bonuses.The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf
onsemi
(Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
Sponsorship evidence
Why Openbound reached the conclusions above.
Visa sponsorship evidence
Current posting
Silent on sponsorship
Other openings
7 of 697 recent openings at this employer state a sponsorship restriction.
Employer H-1B history
- 112
- recent certified H-1B filings
- 76
- new-hire petitions
- 0
- filings for similar roles
- 96
- so far in FY2026
More evidence details
- 112 recent certified H-1B filings across the employer
- Still filing this year — 96 filings in FY2026
- 13 USCIS H-1B new-employment approvals, counted separately from LCA filings
- Some filing activity in NY
- 78 further USCIS approvals for extensions or transfers
- We checked 194 filing titles for this employer and none describe work like this role
- 7 other recent postings at this company state a sponsorship restriction
- The posting says nothing about sponsorship either way
Some filing activity in NY.
Green card sponsorship evidence
Employer PERM history
- 10
- recent certified PERM filings
- 0
- filings for similar roles
- 2
- filings in this location
Filing history reflects past employer behavior; it isn't a promise for this opening.
All open roles at ON SemiconductorHow Openbound evaluates sponsorship
Visa history uses official U.S. Department of Labor H-1B LCA disclosure data and USCIS H-1B petition history. Green card history uses DOL PERM disclosure data. Each is read for the employer as a whole, for roles like this one, and for this location, weighted toward the most recent fiscal years.
An employer is matched to its filing entities by verified legal name and reviewed aliases; a match is never made on a name resemblance alone. Where no verified entity can be matched, the page says so and draws no conclusion from the absence. 194 filing titles were examined for this employer.
What this posting states outranks history in both directions, and an employer's published policy outranks past filings. Filing history reflects past behavior; it is not a promise of sponsorship for this opening, and none of this is legal advice.