SIPI Engineer, Sr.
Immigration summary
Visa sponsorship
This employer sponsors, but not for roles like this one.
1,599 recent H-1B filings
View visa evidenceGreen card sponsorship
This employer has recently sponsored green cards at scale.
89 recent certified PERM filings
View green card evidenceJob description
Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
The Qualcomm CHS (Central Hardware System) has exciting opportunities in the areas of signal integrity and power integrity in next generation server project. The candidate will work with IC, Package and PBC designers to find ways to optimize the overall System performance. The candidate’s first responsibility is working with substrate designers to make sure all system level constraints are met prior to the package Tape-out. The candidate is expected to communicate with PHY owners to understand the Specs for various IPs such as LP6, PCIe, 224G, etc, and also with PCB designers to assess the impact of Ball assignment to the system level performance. This position offers the opportunity to work across multiple organizations such as IP, PKG & PCB design and simulation teams.
The responsibilities will include but not be limited to the following:
• Perform package extraction for the time domain and frequency domain analysis
• Perform system-level analysis for DDR, SerDes & PDN analysis
• Develop design guidelines for Package and PCB design
• Create technical documentation and presentations
Preferred Qualifications:
• 3+ years of experience in DDR/SerDes in Package/PCB/System Design related to compute, Auto and/or Server projects
• Experience in Electromagnetics and solid background on transmission line theory & Crosstalk
• Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI and Clarity
• Experience in simulation tools such as ADS and Hspice
• Working knowledge in Cadence Allegro/APD/Sip or Mentor Xpedition
• Experience in utilizing AI to gain efficiency is a strong plus.
• Experience in Matlab
• Experience in design specifications such as LPDDRx, PCIe, Xlink
• Master Degree with 3 ~ 4 years of experiences is preferred, Ph.D with minimal experience is considered as well
Minimum Qualifications:
• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies
: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range
and Other Compensation & Benefits:
$133,900.00 - $200,900.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
Sponsorship evidence
Why Openbound reached the conclusions above.
Visa sponsorship evidence
Current posting
Silent on sponsorship
Other openings
21 of 1748 recent openings at this employer state a sponsorship restriction.
Employer H-1B history
- 1,599
- recent certified H-1B filings
- 1,049
- new-hire petitions
- 0
- filings for similar roles
- 987
- so far in FY2026
More evidence details
- 1,599 recent certified H-1B filings across the employer
- Still filing this year — 987 filings in FY2026
- 1,049 USCIS H-1B new-employment approvals, counted separately from LCA filings
- Strong filing activity in CA
- 2,949 further USCIS approvals for extensions or transfers
- We checked 171 filing titles for this employer and none describe work like this role
- 21 other recent postings at this company state a sponsorship restriction
- The posting says nothing about sponsorship either way
Strong filing activity in CA.
Green card sponsorship evidence
Employer PERM history
- 89
- recent certified PERM filings
- 0
- filings for similar roles
- 78
- filings in this location
Filing history reflects past employer behavior; it isn't a promise for this opening.
All open roles at QualcommHow Openbound evaluates sponsorship
Visa history uses official U.S. Department of Labor H-1B LCA disclosure data and USCIS H-1B petition history. Green card history uses DOL PERM disclosure data. Each is read for the employer as a whole, for roles like this one, and for this location, weighted toward the most recent fiscal years.
An employer is matched to its filing entities by verified legal name and reviewed aliases; a match is never made on a name resemblance alone. Where no verified entity can be matched, the page says so and draws no conclusion from the absence. 171 filing titles were examined for this employer.
What this posting states outranks history in both directions, and an employer's published policy outranks past filings. Filing history reflects past behavior; it is not a promise of sponsorship for this opening, and none of this is legal advice.